Snapdeal, on their first day of annual tech summit in Maui, Hawaii, announced the launch of its three smartphone chipsets. Snapdragon 865 flagship SoC is first among the list of three chipsets, and do not integrate with X55 5G modem while snapdragon 855 and 855+ chipsets are integrated with the 5G modem. The latest chip supports the X55 5G modem, which was launched earlier this year but the modem is not integrated with the chips. Further, it is boosted by enhanced AI performance and the graphics capabilities are amplified up to 25 percent. The new flagship models of the smartphones will be loaded with new chips.
The other two chips announced were snapdragon 765 and snapdragon 765G and the most important thing is that they are featured with 5G modems integrated with it. Soon they will be featured in more affordable phones. HMD global will be soon become one of the first organizations to launch new smartphones in the early next year which will be based on the Snapdragon mobile platform.
Qualcomm hasn’t revealed many details of the new chips yet as it is going to launch the chips very soon. As it was announced, the chips will house an improved AI engine, capable of 15TOPS (trillion operations per second). Qualcomm says that the current chips are efficient more than twice of snapdragon 855. The latest ISP is capable of capturing 8K videos at 60fps. On the other hand, Snapdragon 765 and 765G are equipped with enhanced qualities like HDR10 4K video recording and can work with up to 192 MP camera sensors.
The QUALCOMM has declared its next-generation ultrasonic fingerprint sensor technology known as 3D Sonic Max. it is rumored that it provides a recognition area which is 17times larger than the previous generation and support authorization with two fingers together.
The chip manufacturer announced that Coolpad, Blackshark, IQOO, Meizu, Lenovo, nubia, Redmagic, Oneplus, Redmi, Realme, Smatisan, TCL, Vivo, Windtech, ZTE and 8848 will feature the freshly declared 5G SoCs in their phones next year.